3D Solder Paste Inspection

Integrate Our 3D SPI Systems into Your Production Line

The PCBA manufacturing process has become more complex with the increased introduction of smaller components. It’s been proven that during the solder paste printing process there can be serious problems with solder paste height, area and volume, which is a crucial in making sure that there is a reliable and good quality solder joint. Long-term reliability is associated with this part of the process. Our 3D SPI equipment has the technology to assist your PCBA manufacturing process…guaranteed!

3D SPI Systems

Our Highly Effective 3D Solder Paste Inspection Systems

Process control has become crucial and a key element in ensuring that the solder paste printing process has been initiated correctly during the manufacturing process of PCBAs. Our 3D solder paste inspection systems are a perfect solution. These 3D SPI solutions have the ability to quickly and accurately inspect each solder paste deposit in order to provide immediate corrective actions to bring your printing process back into control.

Take Control Of Your Process With Our 3D Solder Paste Inspection Machines

When you incorporate our 3D Solder Paste Inspection equipment into your manufacturing process, you’ll benefit in a number of ways:

  • Immediate feedback to effective corrective action controls
  • Overall efficiencies in your print process
  • Quality built boards from the start
  • Inspection technology that is high-resolution
  • Huge Return on Investment

We’re confident that you will find significant value in using our highly accurate 3D SPI equipment during your printing process. Call now for a no obligation onsite print evaluation. Toll free: 888-478-2912