LineMaster Fusion 3D

LineMaster Fusion 3D provides high speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features. LineMaster's completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.

Key Features & Benefits

  • Solder Paste Height, Area,Volume, X-Y Registration, Bridging Measurements
  • Color 3D Profiles of Measured Features
  • Windows 7 Pro or Windows 10 Pro OS
  • Two-Year, End-User Warranty with Technical Support
  • PSI 1500 3D Camera Technology
  • Dell® PC and LCD  Monitor
  • 24″ x 24″ Inspection Area
  • NIST Traceable Standard
  • Hardware/Software Reference and Online Help

Specifications

Inspection Speed .33 Sec./FOV
Height Accuracy 1µm (0.04 mils)
Gauge R&R <<10% (+/- 40% Tolerance)
Z Resolution 0.20 µm (.008 mils)
Lateral Resolution (X-Y) 8µm (.3 mils)
Minimum Paste Deposit 51µm (2 Mils)