VisionPro® AP212
Legacy SPI

VisionPro® AP212

Automated Offline SPI

VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

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Description

Key Features & Benefits

  • Measure Height, Area, Volume
  • 3D Qualitative Analysis
  • Windows® 7 / 10 OS
  • Two-Year, End-User Warranty
  • VisionPro 3D Sensor
  • Dell® PC and LCD  Monitor
  • Large Work Surface
  • NIST Traceable Standard
  • Hardware/Software Reference

Specifications
Inspection Speed .33 Sec./FOV
Height Accuracy 1µm (0.04 mils)
Gauge R&R <<10% (+/- 40% Tolerance)
Z Resolution .48 µm (.019 mils)
Lateral Resolution (X-Y) 6.8µm (.27 mils)
Minimum Paste Deposit 51µm (2 mils)

Data Sheets

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