by ASC | May 5, 2020 | 3D SPI, Solder Paste Inspection
3D solder paste inspection, also called SPI is a technique for testing printed circuit boards to make sure that they are printed correctly. You use a machine to monitor the solder paste alignment and volume during the printing process. It is important that the volume...
by ASC | Apr 4, 2020 | Solder Paste Inspection
Solder paste inspections are important because they check the solder paste deposits that are made when the Printed Circuit Board (PCB) is manufactured. Most defects are a result of improper solder paste printing, so having an inspection will allow you to reduce the...
